Tokuyama EE Bond
Tokuyama EE Bond

- Dental adhesive system specifically designed for enamel etching technique, which is considered the ideal approach to obtain a good seal of margins and appropriate resin tag infiltration into the dentin. - These features help to ensure the aesthetics of the margins in the long term and minimize post-operative sensitivity, associating force of adhesion to the tooth structure, providing greater integrity to the dentin. **For further product information, please contact Chat Support**

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Tokuyama EE Bond

USD 75

1 Bottle5 Ml
1

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